Nitride films deposited from an equimolar Al–Cr–Mo–Si–Ti alloy target by reactive direct current magnetron sputtering

Hui-Wen Chang; Ping-Kang Huang; A. Davison; Jien‐Wei Yeh; Chun-Huei Tsau; Chih-Chao Yang

doi:10.1016/j.tsf.2008.01.019

Keywords

Materials scienceNitrideSubstrate (aquarium)TinSputter depositionAmorphous solidSputteringAnalytical Chemistry (journal)ArgonThin filmDeposition (geology)CoatingCavity magnetronAlloyMetallurgyLayer (electronics)Chemical engineeringComposite materialCrystallographyNanotechnologyChemistry

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Publication Info

Year: 2008
Type: article
Volume: 516
Issue: 18
Pages: 6402-6408
Citations: 108
Access: Closed

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APA Style

                            
                                
                                    Hui-Wen Chang, 
                                
                                    Ping-Kang Huang, 
                                
                                    A. Davison
                                
                                et al.
                            
                            (2008). 
                            Nitride films deposited from an equimolar Al–Cr–Mo–Si–Ti alloy target by reactive direct current magnetron sputtering. 
                            Thin Solid Films
                            , 516
                            (18)
                            , 6402-6408.
                            https://doi.org/10.1016/j.tsf.2008.01.019
                        

Identifiers

DOI: 10.1016/j.tsf.2008.01.019