A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations

Jeong-Hyeon Park; Eun Hye Lee; I.W. Kim; Hyun-Woo Jung; Jihyun Kim; Jungwan Cho; Jong‐hyoung Kim; Tae‐Ik Lee; Seung‐Kyun Kang; Eun‐Ho Lee

doi:10.1016/j.mssp.2025.110321

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Publication Info

Year: 2025
Type: article
Volume: 205
Pages: 110321-110321
Citations: 0
Access: Closed

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APA Style

                            
                                    Jeong-Hyeon Park, 
                                
                                    Eun Hye Lee, 
                                
                                    I.W. Kim
                                
                                et al.
                            
                            (2025). 
                            A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations. 
                            Materials Science in Semiconductor Processing
                            , 205
                            
                            , 110321-110321.
                            https://doi.org/10.1016/j.mssp.2025.110321

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DOI: 10.1016/j.mssp.2025.110321

Data Quality

Data completeness: 63%